The more times you take a heat gun to "Re-Flow" the solder, the more you damage the solder balls under the BGA'S and the higher of a chance of killing some chips,etc. First you had E73 only and now you're getting 0022, which isn't good.
You can try to heat the top again but you need something to heat the bottom up as well or you will warp the board. Re-Flowing one side and then waiting for it to cool and then heating the other side isn't going to help you any and isn't a good idea...
It sounds like you have taken that heat gun to it too much... =/
The reason why I am against heat guns and ovens...If you would have taken it somewhere rather than heat gunning it, it probably would have booted but now you're in some mess with the 0022. All I can say is good luck...