do you have a a link to a tutorial or picture of these points?
how small is small for example soldering on the leg of the NAND is something i would rather not attempt (thats why i used the alt points)
all tho i do know the e-fuses are contained in the CPU so im going to assume (and if im right its some thing i will not be able to do without lots of practice) that the solder points have to deal with the tiny circuitry under the CPU (to compare circuitry it would be like soldering/de-soldering on a CPU socket for a PC mobo)
is there alternate points for this mod? every lead leads to some where else will where the lead achieve the same goal?
and another question i am curious about i have the CPU key (obviously because of xcell and freeboot) that regardless of the E-Fuse's beng blown (unless the efuse's effect the performance of the JTAG itself) i thought the efuse's simply blew the "fuse's" that were read in the launch of xcell that gave us the CPU key in the fitst place (the fuse sets read off at launch) ONLY making it not possible to retrieve the CPU key (wich is fuse set 3 and 5 or 4 and 6 on the xcell launch)
im not entireley sure how the whole JTAG exploit works how eve i would like to be elightned, in laymens terms how ever kind of like how the PS3 dongle was explained at the CCC confrence PS3 epic fail video i understood that (
http://www.youtube.com/watch?v=LuIlbmn-4A4 )
thank you for your reply i was beginning to think i wasent going to get one lol
another question is it possible to blow the efuse's without the actual update being installed?
I dont have any links but if you search you'll find pics, you dont actually touch the efuses you only disable the ability for them to be burnt with an update. You dont touch the nand chip either, once the efuse is burnt that its cpu key or not you are back to a stock console. Its not minute soldering but very small points that need to be bridged.